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Xilinx 4000 series
- 1. Xilinx 4000 SeriesFPGA ME- Applied Electronics(PT) Department Of Electrical And Electronics Engineering PSG College of Technology (Autonomous) Coimbatore
- 2. CONFIGURABLE GLOBAL INTERCONNECTION CONFIGURABLE INPUT/OUTPUT BLOCKS CONFIGURABLE LOGIC BLOCKS Fixed array ofConfigurable Logic Blocks (CLBs) connectable by a system of pass transistors, driven by SRAM cells
- 3. *CLB: Configurable logicBlocks *IOB: Input/output blocks *Programmable interconnections
- 4. CLB: 2 FF perCLB + 2 per I/O cell 25 gates per CLB for logic 32 bits of SRAM per CLB Special fast carry logic between CLBs Interconnects: Direct and general-purpose wires replaced with more efficient single- length and double-length lines. Sufficient resources for most applications Features: Synchronous Single and Dual-Port RAM Internal Three-state buffers. System performance to 80 MHz 0.5 µ SRAM Process Technology
- 5. Logic blocks (CLB) *configurablelogic block, logic element, logic module, logic unit, logic array block, *to implement combinational and sequential logic Interconnect *wires to connect inputs and outputs to logic blocks I/O blocks *special logic blocks at periphery of device for external connections
- 7. CLB - ConfigurableLogic Block * 5-input, 1 output function * 2 4-input, 1 output functions * optional register on outputs Built-in fast carry logic Can be used as memory Three types of routing * direct * general-purpose * long lines of various lengths RAM-programmable * can be reconfigured
- 8. Use RAM fortruth tables * F, G: 4 input -> 16 bits of RAM (each) * H: 3 input –> 8 bits of RAM * RAM is loaded at system initialization from external PROM MUX control logic maps 4 control inputs into 4 inputs: * LUT input H1 * Direct In (DIN) * Enable Clock (EC) * Set/Reset control (S/R) for FFs •Control F,G LUTs as 32 bit SRAM Broad capability: *Any 2 functions of 4 variables plus a function of 3 variables *Any function of 5 variables *Any function of 4 variables plus some functions of 6 variables *Some functions of 9 variables * Parity *4-bit case cadable equality checking
- 11. Output: Combinational or registered; director inverted Input: combinational. Or registered; zero hold time option Internal FFs for input & output paths Fast/Slow outputs 5 ns vs. 30 ns rise Pull-up/down used with unused IOBs
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- 14. 3 types: * FastDirect Connections * General Purpose Connections with Switching Matrix *Horizontal/Vertical Long Lines Types of lines: * Single length (8) * Double length (4) * Long lines (6) * Global lines (4)
- 15. Direct interconnect: Adjacent CLBsare wired together in the horizontal or vertical direction. The most efficient interconnect (< 1 ns delay) General-purpose interconnect: used mainly for longer connections or for signals with a moderate fan-out Few, so problem in fitting a large design intoXC3000, and 2000 Long line interconnect: for time critical signals (e.g.clock signal need be distributed to many CLBs
- 16. *Between neighboring locks *FromCLB to CLB *From CLB to IOB *Fastest, short distance connections *X: Horizontal Connection * Y: Vertical connection
- 21. Implementation of randomlogic *easier changes at system-level (one device is modified) * can eliminate need for full-custom chips Prototyping * ensemble of gate arrays used to emulate a circuit to be manufactured * get more/better/faster debugging done than possible with simulation Reconfigurable hardware * one hardware block used to implement more than one function *functions must be mutually-exclusive in time * can greatly reduce cost while enhancing flexibility * RAM-based only option Special-purpose computation engines * hardware dedicated to solving one problem (or class of problems) *accelerators attached to general-purpose computers
- 22. *Faster than CPUsolution *Lower power than CPU solution (usually) *Low NRE costs *Off-the-shelf part designed by FPGA vendor *You are sharing NRE costs with all other customers *Fast design time *Low time-to-market *Fast re-design / re-fabrication time *Easy to correct an error, to add functionality, in response to spec change *Can even change product after deployment *Good for low to middle volume applications
- 23. *High per-part costs *Highvolume applications should consider ASICs *Perhaps use FPGA for prototyping *Lower performance than ASIC *Higher power than ASIC *More specialized design skills than CPU